DARPA hands IBM £3.4m to develop SELF DESTRUCTING CHIPS
The government tender said: "IBM plans to utilize the property of strained glass substrates to shatter as the driving force to reduce attached CMOS chips into Si and SiO2 powder. A trigger, such as a fuse or a reactive metal layer will be used to initiate shattering, in at least one location, on the glass substrate. An external RF signal will be required for this process to be initiated. IBM will explore various schemes to enhance glass shattering and techniques to transfer this into the attached Si CMOS devices."
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To ensure no secrets go AWOL when sensitive gear is abandoned in the future, DARPA's Vanishing Programmable Resources (VAPR) program is developing "electronic systems capable of physically disappearing in a controlled, triggerable manner".
“The commercial off-the-shelf electronics made for everyday purchases are durable and last nearly forever,” said Alicia Jackson, DARPA program manager.
“DARPA is looking for a way to make electronics that last precisely as long as they are needed,” she added. “The breakdown of such devices could be triggered by a signal sent from command or any number of possible environmental conditions, such as temperature.”
http://www.theregister.co.uk/2014/02/05/now_you_see_it_now_you_dont/
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